Suitable for potting and encapsulation of electronic components, circuits, coil windings, dry capacitors, etc.
Step 1 : Part A and B should be stirred homogeneously before application.
Step 2 : PourPart-A and Part-B in mixing container as per mixing ratio suggested and stir to achieve homogeneous mixture.
Step 3 : Wait for 3-4 minutes to remove traped air then apply as per requirement.
Fast setting
Low viscosity
Good mechanical and electrical properties
Shelf Life: Part A & B should be stored away from light & heat. Partly emptied containers should be tightly closed immediately after use to avoid exposure to light.
Storage: "2 year from date of mfg. for both Part A and Part B (Storage Temp - 2-40 °C)"
