Suitable for potting and encapsulation of electronic components, circuits, coil windings, dry capacitors, etc.
Step 1 : Part A and B should be stirred homogeneously before application.
Step 2 : PourPart-A and Part-B in mixing container as per mixing ratio suggested and stir to achieve homogeneous mixture.
Step 3 : Wait for 3-4 minutes to remove traped air then apply as per requirement.
Step 1 : Surfaces must be clean, dry and free from oil, wax or other contamination.
Step 2 : Mix resin and hardener for one minute thoroughly and then apply on bangle or handicraft substrates as per regular methods of application.
Step 3 : Allow a coating surface to be dried and sticky for bonding of chaton and stones as per requirement.
Step 4 : Allow coating to dry for 24 hrs for optimum bonding strength.
Medium setting
Medium viscosity
Good mechanical and electrical properties
Shelf Life: Part A & B should be stored away from light & heat. Partly emptied containers should be tightly closed immediately after use to avoid exposure to light.
Storage: "2 year from date of mfg. for both Part A and Part B (Storage Temp - 2-40 °C)"
