BONDINSUL 54A/71B is a medium-viscosity, faster-curing, room temperature cure epoxy system. It has exceptionally low shrinkage. It's not advisable for use in clear potting application. Use of silica powder is strongly recommended.
Suitable for potting and encapsulation of electronic components, circuits, coil windings, dry capacitors, etc.
Step 1 : Part A and B should be stirred homogeneously before application.
Step 2 : PourPart-A and Part-B in mixing container as per mixing ratio suggested and stir to achieve homogeneous mixture.
Step 3 : Wait for 3-4 minutes to remove traped air then apply as per requirement.
Fast setting
Medium viscosity
Good mechanical and electrical properties
Shelf Life: Part A & B should be stored away from light & heat. Partly emptied containers should be tightly closed immediately after use to avoid exposure to light.
Storage: "2 year from date of mfg. for both Part A and Part B (Storage Temp - 2-40 °C)"
